Electronic Components Services
ICF-640-S-O| Series | iCF |
|---|---|
| RoHS | RoHS |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
| Features | Open Frame |
| Part Status | Active |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Mounting Type | Surface Mount |
| Pitch - Mating | 0.100" (2.54mm) |
| Housing Material | Liquid Crystal Polymer (LCP) |
| Contact Finish - Post | Tin |
| Operating Temperature | -55°C ~ 125°C |
| Contact Finish - Mating | Tin |
| Contact Material - Post | Beryllium Copper |
| Contact Material - Mating | Beryllium Copper |
| Contact Finish Thickness - Post | - |
| Contact Finish Thickness - Mating | - |
| Number of Positions or Pins (Grid) | 40 (2 x 20) |
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