Electronic Components Services
40-526-10| Series | Lo-PRO®file, 526 |
|---|---|
| RoHS | RoHS |
| Type | DIP, ZIF (ZIP) |
| Features | Closed Frame |
| Part Status | Active |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Pitch - Mating | 0.100" (2.54mm) |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Contact Finish - Post | Tin |
| Operating Temperature | -55°C ~ 105°C |
| Contact Finish - Mating | Tin |
| Contact Material - Post | Beryllium Copper |
| Contact Material - Mating | Beryllium Copper |
| Contact Finish Thickness - Post | 10.0µin (0.25µm) |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Number of Positions or Pins (Grid) | 40 (2 x 20) |
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