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08-4513-10

Part Number
08-4513-10<
Manufacturer
Aries Electronics<
Description
CONN IC DIP SOCKET 8POS GOLD<
Data sheet
08-4513-10

Specifications

SeriesLo-PRO®file, 513
RoHSRoHS
TypeDIP, 0.4" (10.16mm) Row Spacing
FeaturesClosed Frame
Part StatusActive
TerminationSolder
Pitch - Post0.100" (2.54mm)
Mounting TypeThrough Hole
Pitch - Mating0.100" (2.54mm)
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - PostTin
Operating Temperature-55°C ~ 105°C
Contact Finish - MatingGold
Contact Material - PostBrass
Contact Material - MatingBeryllium Copper
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Finish Thickness - Mating10.0µin (0.25µm)
Number of Positions or Pins (Grid)8 (2 x 4)