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BU240Z-178-HT

Part Number
BU240Z-178-HT<
Manufacturer
On Shore Technology Inc.<
Description
CONN IC DIP SOCKET 24POS GOLD<
Data sheet
BU240Z-178-HT

Specifications

SeriesBU-178HT
RoHSRoHS
TypeDIP, 0.6" (15.24mm) Row Spacing
FeaturesOpen Frame
Part StatusActive
TerminationSolder
Pitch - Post0.100" (2.54mm)
Mounting TypeSurface Mount
Pitch - Mating0.100" (2.54mm)
Housing MaterialPolybutylene Terephthalate (PBT), Glass Filled
Contact Finish - PostCopper
Operating Temperature-55°C ~ 125°C
Contact Finish - MatingGold
Contact Material - PostBrass
Contact Material - MatingBeryllium Copper
Contact Finish Thickness - PostFlash
Contact Finish Thickness - Mating78.7µin (2.00µm)
Number of Positions or Pins (Grid)24 (2 x 12)