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DILB16P-223TLF

Part Number
DILB16P-223TLF<
Manufacturer
Amphenol ICC (FCI)<
Description
CONN IC DIP SOCKET 16POS TIN<
Data sheet
DILB16P-223TLF

Specifications

Series
RoHSRoHS
TypeDIP, 0.3" (7.62mm) Row Spacing
FeaturesOpen Frame
Part StatusActive
TerminationSolder
Pitch - Post0.100" (2.54mm)
Mounting TypeThrough Hole
Pitch - Mating0.100" (2.54mm)
Housing MaterialPolyamide (PA), Nylon
Contact Finish - PostTin
Operating Temperature-55°C ~ 105°C
Contact Finish - MatingTin
Contact Material - PostCopper Alloy
Contact Material - MatingCopper Alloy
Contact Finish Thickness - Post100.0µin (2.54µm)
Contact Finish Thickness - Mating100.0µin (2.54µm)
Number of Positions or Pins (Grid)16 (2 x 8)