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28-516-11

Part Number
28-516-11<
Manufacturer
Aries Electronics<
Description
CONN IC DIP SOCKET ZIF 28POS GLD<
Data sheet
28-516-11

Specifications

Series516
RoHSRoHS
TypeDIP, ZIF (ZIP)
FeaturesClosed Frame
Part StatusActive
TerminationSolder
Pitch - Post0.100" (2.54mm)
Mounting TypeThrough Hole
Pitch - Mating0.100" (2.54mm)
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - PostGold
Operating Temperature-
Contact Finish - MatingGold
Contact Material - PostBeryllium Copper
Contact Material - MatingBeryllium Copper
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Finish Thickness - Mating10.0µin (0.25µm)
Number of Positions or Pins (Grid)28 (2 x 14)