Electronic Components Services
44-547-11E| Series | 547 |
|---|---|
| RoHS | RoHS |
| Type | SOIC, ZIF (ZIP) |
| Features | Closed Frame |
| Part Status | Active |
| Termination | Solder |
| Pitch - Post | 0.050" (1.27mm) |
| Mounting Type | Through Hole |
| Pitch - Mating | - |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Contact Finish - Post | Gold |
| Operating Temperature | - |
| Contact Finish - Mating | Gold |
| Contact Material - Post | Beryllium Copper |
| Contact Material - Mating | Beryllium Copper |
| Contact Finish Thickness - Post | 20.0µin (0.51µm) |
| Contact Finish Thickness - Mating | 20.0µin (0.51µm) |
| Number of Positions or Pins (Grid) | 44 (2 x 22) |
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