Electronic Components Services
808-AG11D-LF| Series | 800 |
|---|---|
| RoHS | RoHS |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Features | Open Frame |
| Part Status | Obsolete |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Pitch - Mating | 0.100" (2.54mm) |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Contact Finish - Post | Gold |
| Operating Temperature | -55°C ~ 105°C |
| Contact Finish - Mating | Gold |
| Contact Material - Post | Copper |
| Contact Material - Mating | Beryllium Copper |
| Contact Finish Thickness - Post | 25.0µin (0.63µm) |
| Contact Finish Thickness - Mating | 25.0µin (0.63µm) |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
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