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TS991SNL500T4

Part Number
TS991SNL500T4<
Manufacturer
Chip Quik Inc.<
Description
SOLDER PASTE THERMALLY STABLE NC<
Data sheet
TS991SNL500T4

Specifications

SeriesCHIPQUIK®
RoHSRoHS
FormJar, 17.64 oz (500g)
TypeSolder Paste
ProcessLead Free
Diameter-
Flux TypeNo-Clean
Mesh Type4
Shelf Life12 Months
Wire Gauge-
CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
Part StatusActive
Melting Point423°F (217°C)
Shelf Life StartDate of Manufacture
Storage/Refrigeration Temperature-