Series | CHIPQUIK® |
---|---|
RoHS | RoHS |
Form | Jar, 17.64 oz (500g) |
Type | Solder Paste |
Process | Lead Free |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 4 |
Shelf Life | 12 Months |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Part Status | Active |
Melting Point | 423°F (217°C) |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | - |