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TS391LT50

Part Number
TS391LT50<
Manufacturer
Chip Quik Inc.<
Description
THERMALLY STABLE SOLDER PASTE NO<
Data sheet
TS391LT50

Specifications

Series
RoHSRoHS
FormJar, 1.76 oz (50g)
TypeSolder Paste
ProcessLead Free
Diameter-
Flux TypeNo-Clean
Mesh Type4
Shelf Life12 Months
Wire Gauge-
CompositionBi57.6Sn42Ag0.4 (57.6/42/0.4)
Part StatusActive
Melting Point281°F (138°C)
Shelf Life StartDate of Manufacture
Storage/Refrigeration Temperature68°F ~ 77°F (20°C ~ 25°C)