Series | |
---|---|
RoHS | RoHS |
Form | Jar, 1.41 oz (40g) |
Type | Solder Paste |
Process | - |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 7 |
Shelf Life | 6 Months |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Part Status | Active |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |