Series | WS200™ |
---|---|
RoHS | RoHS |
Form | Jar, 17.64 oz (500g) |
Type | Solder Paste |
Process | Leaded |
Diameter | - |
Flux Type | Water Soluble |
Mesh Type | 3 |
Shelf Life | 6 Months |
Wire Gauge | - |
Composition | Sn63Pb37 (63/37) |
Part Status | Obsolete |
Melting Point | 361°F (183°C) |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 32°F ~ 50°F (0°C ~ 10°C) |