Electronic Components Services
| Series | SMD |
|---|---|
| RoHS | RoHS |
| Form | Jar, 1.76 oz (50g) |
| Type | Solder Paste |
| Process | Lead Free |
| Diameter | - |
| Flux Type | No-Clean |
| Mesh Type | 6 |
| Shelf Life | 6 Months |
| Wire Gauge | - |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Part Status | Active |
| Melting Point | 422 ~ 428°F (217 ~ 220°C) |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
Whatsapp
Skype
Sales
Tel