Electronic Components Services
| Series | FL250D |
|---|---|
| RoHS | RoHS |
| Form | Jar, 17.64 oz (500g) |
| Type | Solder Paste |
| Process | Leaded |
| Diameter | - |
| Flux Type | No-Clean |
| Mesh Type | 3 |
| Shelf Life | 4 Months |
| Wire Gauge | - |
| Composition | Sn63Pb37 (63/37) |
| Part Status | Active |
| Melting Point | 361°F (183°C) |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 32°F ~ 50°F (0°C ~ 10°C) |
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