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You are here:Home >> Product >> Soldering, Desoldering, Rework Products >> Solder

70-3213-0810

Part Number: 70-3213-0810<

Manufacturer: Kester Solder<

Description: SOLDER PASTE NXG1 NO CLEAN 500GM<

Data sheet: 70-3213-0810

Specifications

Series	NXG1
RoHS	RoHS
Form	Jar, 17.64 oz (500g)
Type	Solder Paste
Process	Lead Free
Diameter	-
Flux Type	No-Clean
Mesh Type	3
Shelf Life	8 Months
Wire Gauge	-
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Part Status	Active
Melting Point	423 ~ 424°F (217 ~ 218°C)
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	32°F ~ 50°F (0°C ~ 10°C)