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4900P-250G| Series | 4900 |
|---|---|
| RoHS | RoHS |
| Form | Jar, 8.8 oz (250g) |
| Type | Solder Paste |
| Process | Lead Free |
| Diameter | - |
| Flux Type | No-Clean |
| Mesh Type | - |
| Shelf Life | 24 Months |
| Wire Gauge | - |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Part Status | Active |
| Melting Point | 423 ~ 430°F (217 ~ 221°C) |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 35°F ~ 50°F (2°C ~ 10°C) |
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