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TS991SNL35T3

Part Number
TS991SNL35T3<
Manufacturer
Chip Quik Inc.<
Description
THERMALLY STABLE SOLDER PASTE NC<
Data sheet
TS991SNL35T3

Specifications

SeriesCHIPQUIK®
RoHSRoHS
FormSyringe, 1.23 oz (34.869g)
TypeSolder Paste
Process-
Diameter-
Flux TypeNo-Clean
Mesh Type3
Shelf Life12 Months
Wire Gauge-
CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
Part StatusActive
Melting Point423°F (217°C)
Shelf Life StartDate of Manufacture
Storage/Refrigeration Temperature37°F ~ 77°F (3°C ~ 25°C)