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You are here:Home >> Product >> Soldering, Desoldering, Rework Products >> Solder

TS391AX250

Part Number: TS391AX250<

Manufacturer: Chip Quik Inc.<

Description: THERMALLY STABLE SOLDER PASTE NO<

Data sheet: TS391AX250

Specifications

Series
RoHS	RoHS
Form	Jar, 8.8 oz (250g)
Type	Solder Paste
Process	Leaded
Diameter	-
Flux Type	No-Clean
Mesh Type	4
Shelf Life	12 Months
Wire Gauge	-
Composition	Sn63Pb37 (63/37)
Part Status	Active
Melting Point	361°F (183°C)
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	68°F ~ 77°F (20°C ~ 25°C)