| Datasheet | Part Number | Manufacturers | Stock | Description |
|
WBNCC633720 | SRA Soldering Products | 5000 | NO-CLEAN FLUX CORE SOLDER, 63/37 |
|
|
SMD291AX10 | Chip Quik Inc. | 5000 | SOLDER PASTE NO-CLEAN 63/37 10CC |
|
|
1354298 | Multicore | 5000 | 63S4 WS200 ACP 500G JAR |
|
|
673832 | Multicore | 5000 | 97SC 400 2% .064DIA 14AWG |
|
|
WCBLF227L2020 | Canfield Technologies | 5000 | BLF227 WATER SOLUBLE FLUX 8 OZ . |
|
|
SMDSN100-S-16 | Chip Quik Inc. | 5000 | SOLDER SHOT SN100 16OZ 454G |
|
|
SMD291SNL10 | Chip Quik Inc. | 5000 | SOLDER PASTE NO-CLEAN 10CC SYR |
|
|
1371245 | Multicore | 5000 | 97SC LF620 DAP89V |
|
|
24-7068-1400 | Kester Solder | 5000 | SOLDER RA .062" 14AWG 1LB |
|
|
CCBLF227L2020 | Canfield Technologies | 5000 | BLF 227 NO CLEAN FLUX 8 OZ .020 |
|
|
SMD291SNL60T4 | Chip Quik Inc. | 5000 | SN96.5/AG3.0/CU0.5 2-PRT MIX 60G |
|
|
SMD291AX10T5 | Chip Quik Inc. | 5000 | SOLDER PASTE NO CLEAN T5 10CC |
|
|
1372425 | Multicore | 5000 | 97SCL F620 DAP89V |
|
|
SMD291SNL250T5 | Chip Quik Inc. | 5000 | SOLDER PASTE SAC305 250G T5 |
|
|
WC6301062 | Canfield Technologies | 5000 | 63SN/37PB WATER SOLUBLE FLUX 1 L |
|
|
4897-454G | MG Chemicals | 5000 | SOLDER RA 60/40 .050" 1 LB |
|
|
SMDSWLF.020 4OZ | Chip Quik Inc. | 5000 | SLD WIRE NO-CLEAN 96.5/3/.5 4OZ. |
|
|
1817240 | Multicore | 5000 | SAC0307 HF212AGS88.5 |
|
|
24-6337-9756 | Kester Solder | 5000 | SOLDER FLUX-CORED/285 63/37 .010 |
|
|
CC6301062E | Canfield Technologies | 5000 | 63SN/37PB NO CLEAN FLUX 1 LB. .0 |
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